品牌
中央處理器
晶片組
HDMI®
無風扇強固系統
型號
品牌
中央處理器
晶片組
USB/SATA/COM/LAN 電腦接口
顯示
溫度
擴充插槽
尺寸
規格書 / 查詢
NISE 3910E16/E2/P2/P2E-A
Nexcom
13th/12th Gen Intel® Core™ i9/i7/i5/i3 processor
Intel® Q670E PCH
10/3/3/4
HDMI®, DP, VGA
-20°C ~ 60°C
1 x PCIe x16 (E16), or 2 x PCIe x4 (E2), or 2 x PCI (P2), or 1 x PCIe x4 + 1 x PCI (P2E); 1 x M.2 Key B 2242/3042/3052 (for LTE/5G module); 1 x Mini PCIe (for Wi-Fi)
215mm (W) x 272mm (D) x 123mm (H)
NISE 3910R-A
Nexcom
13th/12th Gen Intel® Core™ i9/i7/i5/i3 processor
Intel® Q670E PCH
10/3/3/4
HDMI®, DP, VGA
-20°C ~ 60°C
1 x M.2 3042/3052 Key B (for LTE/5G module), 1 x Mini PCIe (for Wi-Fi)
215mm (W) x 272mm (D) x 102mm (H)
NISE 50 A04-02
Nexcom
NISE 50 A04-02
N/A
2/2/1/3
HDMI®
-20°C ~ 60°C
1 x M.2 3042/3052 Key B (for 4G/5G module)
186mm (W) x 150mm (D) x 28mm (H)
NDiS B361
Nexcom
13th Gen Intel® Core™ processors
N/A
4/1/2/2
2 x HDMI® 1.4 output
-20°C ~ 60°C
1 x M.2 Key B 2242/3052 (for LTE/5G module), 1 x M.2 Key E 2230 (for Wi-Fi module)
200mm (W) x 140mm (D) x 37mm (H)
NDiS B362
Nexcom
Intel® Core™ Ultra U Processor Series
N/A
4/1/2/2
2 x HDMI® 2.0 output
0°C ~ 60°C
1 x M.2 Key B 3052/2242 (for 5G/LTE module), 1 x M.2 Key E 2230 (for Wi-Fi module)
200mm (W) x 140mm (D) x 37mm (H)
NDiS B363
Nexcom
Intel® Core™ Ultra U Processor Series
N/A
4/1/2/2
2 x HDMI® 2.0 output
0°C ~ 60°C
1 x M.2 Key B 3052/2242 (for 5G/LTE module), 1 x M.2 Key E 2230 (for Wi-Fi module)
200mm (W) x 140mm (D) x 37mm (H)
NISE 3910E16/E2/P2/P2E-A
Brand
Nexcom
CPU
13th/12th Gen Intel® Core™ i9/i7/i5/i3 processor
Chipset
Intel® Q670E PCH
USB/SATA/COM/LAN
10/3/3/4
Display
HDMI®, DP, VGA
Temp
-20°C ~ 60°C
Expansion
1 x PCIe x16 (E16), or 2 x PCIe x4 (E2), or 2 x PCI (P2), or 1 x PCIe x4 + 1 x PCI (P2E); 1 x M.2 Key B 2242/3042/3052 (for LTE/5G module); 1 x Mini PCIe (for Wi-Fi)
Dimension
215mm (W) x 272mm (D) x 123mm (H)
規格書 / 查詢
NISE 3910R-A
Brand
Nexcom
CPU
13th/12th Gen Intel® Core™ i9/i7/i5/i3 processor
Chipset
Intel® Q670E PCH
USB/SATA/COM/LAN
10/3/3/4
Display
HDMI®, DP, VGA
Temp
-20°C ~ 60°C
Expansion
1 x M.2 3042/3052 Key B (for LTE/5G module), 1 x Mini PCIe (for Wi-Fi)
Dimension
215mm (W) x 272mm (D) x 102mm (H)
規格書 / 查詢
NISE 50 A04-02
Brand
Nexcom
CPU
NISE 50 A04-02
Chipset
N/A
USB/SATA/COM/LAN
2/2/1/3
Display
HDMI®
Temp
-20°C ~ 60°C
Expansion
1 x M.2 3042/3052 Key B (for 4G/5G module)
Dimension
186mm (W) x 150mm (D) x 28mm (H)
規格書 / 查詢
NDiS B361
Brand
Nexcom
CPU
13th Gen Intel® Core™ processors
Chipset
N/A
USB/SATA/COM/LAN
4/1/2/2
Display
2 x HDMI® 1.4 output
Temp
-20°C ~ 60°C
Expansion
1 x M.2 Key B 2242/3052 (for LTE/5G module), 1 x M.2 Key E 2230 (for Wi-Fi module)
Dimension
200mm (W) x 140mm (D) x 37mm (H)
規格書 / 查詢
NDiS B362
Brand
Nexcom
CPU
Intel® Core™ Ultra U Processor Series
Chipset
N/A
USB/SATA/COM/LAN
4/1/2/2
Display
2 x HDMI® 2.0 output
Temp
0°C ~ 60°C
Expansion
1 x M.2 Key B 3052/2242 (for 5G/LTE module), 1 x M.2 Key E 2230 (for Wi-Fi module)
Dimension
200mm (W) x 140mm (D) x 37mm (H)
規格書 / 查詢
NDiS B363
Brand
Nexcom
CPU
Intel® Core™ Ultra U Processor Series
Chipset
N/A
USB/SATA/COM/LAN
4/1/2/2
Display
2 x HDMI® 2.0 output
Temp
0°C ~ 60°C
Expansion
1 x M.2 Key B 3052/2242 (for 5G/LTE module), 1 x M.2 Key E 2230 (for Wi-Fi module)
Dimension
200mm (W) x 140mm (D) x 37mm (H)
規格書 / 查詢
