Brand
CPU
Chipset
2 x HDMI® 1.4 output
Fanless Rugged System
Model
Brand
CPU
Chipset
USB/SATA/COM/LAN
Display
Temp
Expansion
Dimension
Datasheet / Enquiry
NDiS B361
Nexcom
13th Gen Intel® Core™ processors
N/A
4/1/2/2
2 x HDMI® 1.4 output
-20°C ~ 60°C
1 x M.2 Key B 2242/3052 (for LTE/5G module), 1 x M.2 Key E 2230 (for Wi-Fi module)
200mm (W) x 140mm (D) x 37mm (H)
NDiS B361
Brand
Nexcom
CPU
13th Gen Intel® Core™ processors
Chipset
N/A
USB/SATA/COM/LAN
4/1/2/2
Display
2 x HDMI® 1.4 output
Temp
-20°C ~ 60°C
Expansion
1 x M.2 Key B 2242/3052 (for LTE/5G module), 1 x M.2 Key E 2230 (for Wi-Fi module)
Dimension
200mm (W) x 140mm (D) x 37mm (H)
Datasheet / Enquiry
