Brand
13th Gen Intel® Core™ processors
Chipset
Display
Fanless Rugged System
Model
Brand
CPU
Chipset
USB/SATA/COM/LAN
Display
Temp
Expansion
Dimension
Datasheet / Enquiry
CE-RL-01
Nexcom
13th Gen Intel® Core™ processors
N/A
5/2/1/4
4 x DisplayPort DP++, 1 x USB Type-C
0°C ~ 55°C
2 x M.2 2242 or 2280 (SATA and NVMe supported)
260mm (W) x 216mm (D) x 55mm (H)
NDiS B361
Nexcom
13th Gen Intel® Core™ processors
N/A
4/1/2/2
2 x HDMI® 1.4 output
-20°C ~ 60°C
1 x M.2 Key B 2242/3052 (for LTE/5G module), 1 x M.2 Key E 2230 (for Wi-Fi module)
200mm (W) x 140mm (D) x 37mm (H)
CE-RL-01
Brand
Nexcom
CPU
13th Gen Intel® Core™ processors
Chipset
N/A
USB/SATA/COM/LAN
5/2/1/4
Display
4 x DisplayPort DP++, 1 x USB Type-C
Temp
0°C ~ 55°C
Expansion
2 x M.2 2242 or 2280 (SATA and NVMe supported)
Dimension
260mm (W) x 216mm (D) x 55mm (H)
Datasheet / Enquiry
NDiS B361
Brand
Nexcom
CPU
13th Gen Intel® Core™ processors
Chipset
N/A
USB/SATA/COM/LAN
4/1/2/2
Display
2 x HDMI® 1.4 output
Temp
-20°C ~ 60°C
Expansion
1 x M.2 Key B 2242/3052 (for LTE/5G module), 1 x M.2 Key E 2230 (for Wi-Fi module)
Dimension
200mm (W) x 140mm (D) x 37mm (H)
Datasheet / Enquiry
